| 电镀工艺过程的微机控制 |
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| 引用本文： | 谢桂海.电镀工艺过程的微机控制[J].军械工程学院学报,1989(1). |
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| 作者姓名： | 谢桂海 |
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| 作者单位： | 军械工程学院计算机教研室 |
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| 摘 要： | 本文论述了采用程序控制法,完成镀液主元离子浓度最优控制的设计思想、设计步骤和实现方法,并给出了具体设计实例和程序框图。按本文介绍的方法设计的“电镀工艺过程微机控制系统”,已在一些厂家试用。结果表明:镀层质量和电镀效率有很大提高,具有明显的经济效益和社会效益。
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| 关 键 词： | 电镀 微机 控制 优化 |
MICRO-COMPUTER CONTROL OF ELECTROPLATING PROCEDURE |
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| Xie Guihai,Teaching and Research Section of Computer Science.MICRO-COMPUTER CONTROL OF ELECTROPLATING PROCEDURE[J].Journal of Ordnance Engineering College,1989(1). |
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| Authors: | Xie Guihai Teaching and Research Section of Computer Science |
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| Abstract: | Discussed in this paper are the design idea, its design procedure and practical method for the achievement of optimal control of the density of the main ion in plating liquid. The electroplating technological procedure controlled by a micro-computer system, discussed in this paper, has already been on trial in some factories, and the result shows that both the equality of plating coat and its efficiency have been greatly improved, thus gaining good economic and social benefits. |
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| Keywords: | electroplating micro-computer control |
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