FECL100K组件在强迫风冷下的热传递模型

文中运用传热学理论,用电模拟法建立了FECL100K24线陶瓷扁平封装组件在强迫风冷条件下的等效热路,并在此基础上推算出其热传递数学模型,为电子计算机辅助热设计提供了基础。文中还运用所建立的等效热路和数学模型,对该组件在电子设备中安装形式的合理性进行了论证。

Heat-transfer Model for FECL100K under the Circumstance of Forced Air Cooling

With the application of heat-transfer theory an equivalent thermal network (electrothermal analog circuit) is set up by electrothermal analogy which is for FECL100K under the circumstance of forced air cooling. The mathematic model of heat-transfer for the network is also given. It provides a foundation for com- puter aided thermal design. By applying the equivalent thermal network and its model the reasonablen- ess of placement form of this package in electronic equipment is expounded.