| 冷却电子组件的微型热管性能研究 |
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| 引用本文： | 周继珠.冷却电子组件的微型热管性能研究[J].国防科技大学学报,1993,15(2):36-40. |
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| 作者姓名： | 周继珠 |
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| 作者单位： | 国防科技大学航天技术系 |
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| 摘 要： | 本文对微型热管在冷却电子组件中传热性能进行了实验研究。从应用的角度提出了微型热管最大应用功率的概念,给出风速、风温、安装位置和工质充装量等因素对最大应用功率影响的实验结果。并与相同结构铜制散热片的性能进行了比较。
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| 关 键 词： | 热管技术 冷却 微电子组件 热控制 |
| 收稿时间： | 5/6/1992 12:00:00 AM |
Research of the Heat Transfer Characteristics of Micro Heat Pipe Used to Cool Electric Components |
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| Zhou Jizhu.Research of the Heat Transfer Characteristics of Micro Heat Pipe Used to Cool Electric Components[J].Journal of National University of Defense Technology,1993,15(2):36-40. |
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| Authors: | Zhou Jizhu |
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| Institution: | Department of Aerospace Technology |
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| Abstract: | The experimental investigation of the heat transfer characteristics of the micro heatpipe used to cool the electronic components was presented in this paper. From the pointof vlew of application, the concept of the maximum applicable power was proposed. Theexperimental results of the maximum applicable power vs. air velocity, wind tempera-ture, mounting site and filling quantity of working fluid were given. In addition, the ef-fect of using heat pipe for cooling modules was compared with that of using copper fin. |
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| Keywords: | heat pipe cooling micro electronic component thermal control |
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