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An Investigation on a Tin Fixed Abrasive Polishing Pad with Phyllotactic Pattern for Polishing Wafer |
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| Institution: | School of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, Liaoning, China;School of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, Liaoning, China;School of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, Liaoning, China |
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