纸面石膏板耐火性能试验研究

利用扫描电子显微镜，对经历不同温度和冷却方式的纸面石膏板试块的显微结构进行观察和分析。结果表明：在不同受热温度和冷却方式条件下，纸面石膏板的结构和强度将发生改变。当受热温度达到300℃时，护面纸与石膏芯材结合松动，护面纸发生热分解、炭化，石膏芯材产生裂纹，网状晶体骨架结构疏松、断裂、破碎，完整性遭到破坏，强度基本丧失；受热温度越高，纸面石膏板结构和强度的破坏越严重。

Testing Study of Fire Resistance for Thistle Board

Microstructure of thistle board undergoing different fire scene temperature and cooling ways was observed and analyzed by using SEM. The results show that under the condition of different fire temperatures and cooling ways, the structure and intensity of thistle board are different. When temperature reaches 300℃, bond between face - sheet paper and sandwiched - in gypsum becomes loosen, paper decomposes and chars, and net - shaped gypsum crystal frame begins to break and crake, its integrity is destroyed, and the intensity almost, lost The higher temperature is, the more serious destruction of microstructure of thistle board is.