| 残余应力作用下脆性膜/基材料的断裂行为 |
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| 引用本文： | 杨班权,李朋. 残余应力作用下脆性膜/基材料的断裂行为[J]. 装甲兵工程学院学报, 2011, 25(1): 88-91 |
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| 作者姓名： | 杨班权 李朋 |
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| 作者单位： | 装甲兵工程学院机械工程系,北京,100072 |
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| 基金项目： | 国家自然科学基金资助项目(10802007) |
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| 摘 要： | 假定膜内的残余拉应力足以使膜发生开裂,利用膜/基材料中含弹性界面层的剪滞模型,研究了脆性膜/基材料在残余应力作用下的开裂行为特征,探讨了膜内正应力、膜/基界面切应力的分布规律,获得了膜的裂纹密度与残余应力大小之间的解析表达式。在裂纹密度、材料的力学和几何参数确定的情况下,该解析表达式可以用来评估残余应力的大小。最后,分析了膜的裂纹密度与残余应力、膜的厚度、弹性模量、断裂强度以及界面层的切变模量之间的内在关联,绘出了这些参数影响膜裂纹密度的变化曲线。
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| 关 键 词： | 脆性膜/基材料 残余应力 裂纹密度 |
Fracture Behavior of a Brittle Thin Film/Substrate System under Residual Stress |
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| YANG Ban-Quan,LI Peng. Fracture Behavior of a Brittle Thin Film/Substrate System under Residual Stress[J]. Journal of Armored Force Engineering Institute, 2011, 25(1): 88-91 |
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| Authors: | YANG Ban-Quan LI Peng |
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| Affiliation: | YANG Ban-Quan,LI Peng (Department of Mechanical Engineering,Academy of Armored Force Engineering,Beijing 100072,China) |
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| Abstract: | The fracture behavior of a brittle thin film on an elastic substrate under residual stress is investigated in this paper.It is assumed that the residual stress in the thin film is large enough to cause the thin film to crack by means of a modified shear-lag model,the analytical solutions for the distribution laws of the tensile stress developed in the thin film,the shear stress developed along the interface and the relationship between the crack density of the thin film and the residual stress can be obtain... |
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| Keywords: | brittle thin film/substrate system residual stress crack density |
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